Lithography
Raith (Leica) EBPG 5000+
MJB4 UV Mask Aligner
Description: Suss Microtech MJB4 mask aligner
Tier 1
MJB3 UV Mask Aligner
Description: Karl Suss MJB3 UV Mask Aligner
Tier 0
Spin coater
Description: Laurell Technologies WS-650MZ Spin Coater.
Tier 0
Deposition
Plasma-therm PECVD
Description: Plasma-therm Advanced Vacuum PECVD with silane and ammonia source gasses capable of depositing high quality SiOx and SiNx films.
Tier 3
Denton Pro Desktop Sputterer
Description: Denton Pro Desktop Sputtering System.
Tier 1
Temescal Ebeam Evaporator
Description: Temescal FC-2000 electron beam evaporator.
Tier 1
V&N Ebeam Evaporator
Description: V&N Automation Systems electron beam evaporator.
Tier 1
Bell jar Thermal Evaporator
Description: Cooke Vacuum CVE 301 thermal evaporator
Tier 1
Etching
Takachi (formerly Apex) etcher
Description: Plasma-therm Advanced Vacuum Apex SLR ICP etcher. The tool has 2 Mhz 1kW Source power and 13.56 Mhz 300W Bias power. Eight gases are available: Cl2, BCl3, C4F8, CHF3, SF6, CF4, O2 and Ar. 4" wafers are mechanically clamped and have helium backside cooling.
Tier 2
Oxford Plasma Pro 100
Description: Oxford Plasma Pro 100. 3kW 13.56 Mhz ICP source power. 600W 13.56 Mhz RIE power. Gases include Cl2, BCl3, CH4, O2, H2, Ar, C4F8, SF6. 4” mechanically clamped and have helium backside cooling.
Tier 3
III-V Unaxis Shuttleline etcher
Description: Plasma-therm Unaxis Shuttleline ICP etcher. The tool has 2 Mhz 2.5kW Source and 13.56 Mhz 300W Bias power. Seven gases are available: Cl2, BCl3, Ar, CH4, O2, H2 and N2. 3" wafers are mechanically clamped and have helium backside cooling.
Tier 2
Characterization
AFM
Description: Bruker Veeco Nanoscope D3100 Atomic Force Microscope
Tier 3
Profilometer
Description: Bruker Dektak XT surface profilometer. 838-031-05, 2um Type B stylus is installed.
Tier 0
Nikon Optical Microscope
Description: Nikon L150 Optical Microscope and digital camera.
Tier 0
Filmetrics
Description: Filmetrics F20 optical film measurement tool
Tier 0
Other
RTP-600S
Description: Modular Processing Technology RTP-600S. It is sometimes called a Rapid Thermal Annealer or Rapid Therm Processing tool. IMPORTANT: due to an internal water flow issue the tool may NOT be used for longer than 60 seconds or temperatures higher than 600C.
Tier 1
Despatch Oven
Description: Despatch Protocol Plus LCC/LCD laboratory oven
Tier 0